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1

40 Flip-Chip Process Using Ag–In Transient Liquid Phase Reaction

Lin, W.P., Chu-Hsuan Sha, Lee, C.C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.82 MB

english, 2012

2

Solid State Bonding of Silicon Chips to Silver Buffer on Copper Substrates

Chu-Hsuan Sha, Lee, C.C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.75 MB

english, 2012

3

Silver Microstructure Control for Fluxless Bonding Success Using Ag-In System

Wang, P.J., Chu-Hsuan Sha, Lee, C.C.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 848 KB

english, 2010

4

Low-Temperature Solid-State Silver Bonding of Silicon Chips to Alumina Substrates

Chu-Hsuan Sha, Lee, C.C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1004 KB

english, 2011

5

40-$\mu{\rm m}$ Cu/Au Flip-Chip Joints Made by 200$^{\circ}{\rm C}$ Solid-State Bonding Process

Lin, Wen P., Sha, Chu-Hsuan, Lee, Chin C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 5.08 MB

english, 2013

6

Low-Temperature Bonding to 304 Stainless Steel for High-Temperature Electronic Packaging

Chu-Hsuan Sha,, Lee, C C

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 922 KB

english, 2011

7

Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder

Hsu, Shou-Jen, Sha, Chu-Hsuan, Lee, Chin C.

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 4.29 MB

english, 2014

8

Initial Success on Aluminum Circuit Board Technology

Hsu, Shou-Jen, Sha, Chu-Hsuan, Lee, Chin C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.36 MB

english, 2013

9

Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging

Sha, Chu-Hsuan, Lee, Chin C.

Journal:

Journal of Electronic Packaging

Year:

2011

Language:

english

File:

PDF, 1.51 MB

english, 2011

10

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Sha, Chu-Hsuan, Lee, Chin C.

Journal:

Journal of Electronic Packaging

Year:

2011

Language:

english

File:

PDF, 2.38 MB

english, 2011

11

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Sha, Chu-Hsuan, Lee, Chin C.

Journal:

Journal of Electronic Packaging

Year:

2011

Language:

english

File:

PDF, 1.03 MB

english, 2011

12

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Sha, Chu-Hsuan, Wang, Pin J., Lin, Wen P., Lee, Chin C.

Journal:

Journal of Electronic Packaging

Year:

2011

Language:

english

File:

PDF, 687 KB

english, 2011

13

Demonstration of silver micro-joints for flip-chip interconnect

Chu-Hsuan Sha, Chin C. Lee

Journal:

Microelectronic Engineering

Year:

2012

Language:

english

File:

PDF, 1.65 MB

english, 2012

14

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - 40μm Ag-AgIn flip-chip interconnect process at 180°C

Lin, Wen P., Sha, Chu-Hsuan, Lee, Chin C.

Year:

2012

Language:

english

File:

PDF, 1.32 MB

english, 2012

15

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Effect of Ag grain size on high temperature joint formation in Ag-In system

Wang, Pin J., Sha, Chu-Hsuan, Lee, Chin C.

Year:

2010

Language:

english

File:

PDF, 1.53 MB

english, 2010

16

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Low temperature bonding to 304 stainless steel for high temperature electronic packages

Sha, Chu-Hsuan, Lee, Chin C.

Year:

2010

Language:

english

File:

PDF, 3.61 MB

english, 2010

17

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Solid-state bonding of silicon chips to silver layer plated on copper substrate

Sha, Chu-Hsuan, Lee, Chin C.

Year:

2010

Language:

english

File:

PDF, 1.06 MB

english, 2010

18

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - 40μm Ag/Au composite flip-chip interconnect using solid state atomic bonding at 200°C

Lin, Wen P., Sha, Chu-Hsuan, Lee, Chin C.

Year:

2012

Language:

english

File:

PDF, 2.13 MB

english, 2012

19

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - 15μm Silver flip-chip technology with solid-state bonding

Sha, Chu-Hsuan, Lee, Chin C.

Year:

2011

Language:

english

File:

PDF, 1.77 MB

english, 2011

20

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Microstructures of silver films plated on different substrates and annealed at different conditions

Lin, Wen P., Sha, Chu-Hsuan, Wang, Pin J., Lee, Chin C.

Year:

2011

Language:

english

File:

PDF, 2.13 MB

english, 2011

21

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Fluxless tin bonding of silicon chips to aluminum substrates

Hsu, Shou-Jen, Sha, Chu-Hsuan, Lee, Chin C.

Year:

2012

Language:

english

File:

PDF, 851 KB

english, 2012

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